1050 aluminum plate for CTP board base

The 1050 aluminum plate used for CTP (Computer to Plate) substrate is an aluminum plate used in the Computer to Plate (CTP) process. CTP technology is a technique that directly converts digital files into printing plates and is widely used in the printing industry. 1050 aluminum plate is a high-purity aluminum alloy, mainly composed of aluminum, with good processability, corrosion resistance, and conductivity. In CTP technology, 1050 aluminum is often used as a printing plate material because it can withstand laser engraving and chemical treatment processes well, thereby achieving high-quality printing effects.

CTP plate aluminum standard:

Typical alloys: 1050A, 1060
Material status: H14
Conventional thickness (mm): 0.1-0.5
Conventional width (mm): 400-1600
Usage: CTP plate base is widely used in offset printing plates such as positive image PS plate, thermal sensitive CTP plate, photosensitive CTP plate, UV-CTP plate, etc

Dimensional deviation:

Allowable thickness deviation+0.003 (mm)
Allowable width deviation+0.5 (mm)
Allowable deviation of board length 0~+1 (mm)
(Strip) Side curvature<0.2 (mm)
Diagonal allowable deviation<2 (mm)

Durability of CTP substrate for 1050 aluminum plate

The CTP substrate of 1050 aluminum plate has good durability, characterized by low density, high strength, moderate wear resistance, easy forming, good hydrophilicity, high stability, and good surface treatment. These advantages make 1050 aluminum plate an indisputable CTP plate substrate. At the same time, the CTP substrate of 1050 aluminum plate also has the advantages of high printing quality, strong printing resistance, environmental friendliness, cleanliness and hygiene, and reasonable cost.

Comparison between 1050 aluminum plate and other CTP substrate materials

1050 aluminum plate is used for CTP substrate, which has the advantages of low density, high strength, good formability, good hydrophilicity, high stability, and good surface treatment. Compared with other CTP substrates, it has good corrosion resistance, conductivity, and thermal conductivity, but lower strength. When selecting CTP plate substrates, the requirements for corrosion resistance and formability should be considered based on actual needs, as well as whether surface anodizing treatment is necessary.